Samtec Inc. EHF-125-01-H-D
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- EHF-125-01-H-D
- Samtec Inc.
- .050 EJECTOR HEADER ASSEMBLY
- Rectangular Connectors - Headers, Male Pins
- EHF-125-01-H-D Hoja de datos
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Lead free / RoHS Compliant - 1213
- Inventario al contado / distribuidor autorizado / inventario restante de la fábrica
- Garantía de calidad de 1 año 》
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| Part Number EHF-125-01-H-D |
| Category Rectangular Connectors - Headers, Male Pins |
| Manufacturer Samtec Inc. |
| Description .050 EJECTOR HEADER ASSEMBLY |
| Package - |
| Series EHF |
| Features Keying Slot |
| Operating Temperature -55°C ~ 125°C |
| Mounting Type Through Hole |
| Termination Solder |
| Style Board to Cable/Wire |
| Current Rating 1.75A |
| Contact Material Phosphor Bronze |
| Number of Positions 50 |
| Connector Type Header |
| Number of Positions Loaded All |
| Number of Rows 2 |
| Insulation Color Black |
| Contact Type Male Pin |
| Fastening Type Latch Lock/Eject Hooks |
| Pitch - Mating 0.050" (1.27mm) |
| Shrouding Shrouded - 4 Wall |
| Contact Length - Mating 0.120" (3.05mm) |
| Contact Length - Post 0.107" (2.71mm) |
| Insulation Height 0.325" (8.25mm) |
| Contact Shape Square |
| Contact Finish - Mating Gold |
| Contact Finish - Post Gold |
| Insulation Material Liquid Crystal Polymer (LCP), Glass Filled |
| Overall Contact Length 0.350" (8.89mm) |
| Contact Finish Thickness - Mating 30µin (0.76µm) |
| Row Spacing - Mating 0.050" (1.27mm) |
| Package_case - |
EHF-125-01-H-D Garantías
• Responda con prontitud
• Calidad garantizada
• Acceso global
• Precio de mercado competitivo
• Servicios todo en uno de la cadena de suministro
Jinftry, es su proveedor de componentes más confiable, bienvenido a enviarnos la consulta, ¡gracias!
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Siéntete libre de contactarnos:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Correo electrónico primero )
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Comments
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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