Samtec Inc. IPL1-104-02-S-D-K
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- IPL1-104-02-S-D-K
- Samtec Inc.
- .100 TERMINAL ASSEMBLY
- Rectangular Connectors - Headers, Male Pins
- IPL1-104-02-S-D-K Hoja de datos
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Lead free / RoHS Compliant - 1704
- Inventario al contado / distribuidor autorizado / inventario restante de la fábrica
- Garantía de calidad de 1 año 》
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| Part Number IPL1-104-02-S-D-K |
| Category Rectangular Connectors - Headers, Male Pins |
| Manufacturer Samtec Inc. |
| Description .100 TERMINAL ASSEMBLY |
| Package - |
| Series Mini Mate? IPL1 |
| Operating Temperature -55°C ~ 125°C |
| Mounting Type Surface Mount |
| Termination Solder |
| Style Board to Cable/Wire |
| Contact Material Phosphor Bronze |
| Number of Positions 8 |
| Voltage Rating 675VAC, 954VDC |
| Connector Type Header |
| Number of Positions Loaded All |
| Number of Rows 2 |
| Insulation Color Natural |
| Contact Type Male Pin |
| Fastening Type Locking Ramp |
| Material Flammability Rating UL94 V-0 |
| Pitch - Mating 0.100" (2.54mm) |
| Shrouding Shrouded - 4 Wall |
| Contact Length - Mating 0.215" (5.46mm) |
| Insulation Height 0.320" (8.13mm) |
| Contact Shape Square |
| Contact Finish - Mating Gold |
| Contact Finish - Post Tin |
| Insulation Material Liquid Crystal Polymer (LCP) |
| Contact Finish Thickness - Mating 30µin (0.76µm) |
| Row Spacing - Mating 0.100" (2.54mm) |
| Package_case - |
IPL1-104-02-S-D-K Garantías
• Responda con prontitud
• Calidad garantizada
• Acceso global
• Precio de mercado competitivo
• Servicios todo en uno de la cadena de suministro
Jinftry, es su proveedor de componentes más confiable, bienvenido a enviarnos la consulta, ¡gracias!
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Siéntete libre de contactarnos:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Correo electrónico primero )
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Comments
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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