Samtec Inc. TSW-101-08-S-D-RA
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- TSW-101-08-S-D-RA
- Samtec Inc.
- CONN HEADER 2POS .100 DL R/A AU
- Rectangular Connectors - Headers, Male Pins
- TSW-101-08-S-D-RA Hoja de datos
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Lead free / RoHS Compliant - 6088
- Inventario al contado / distribuidor autorizado / inventario restante de la fábrica
- Garantía de calidad de 1 año 》
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| Part Number TSW-101-08-S-D-RA |
| Category Rectangular Connectors - Headers, Male Pins |
| Manufacturer Samtec Inc. |
| Description CONN HEADER 2POS .100 DL R/A AU |
| Package - |
| Series TSW |
| Operating Temperature -55°C ~ 125°C |
| Mounting Type Through Hole, Right Angle |
| Termination Solder |
| Style Board to Board or Cable |
| Contact Material Phosphor Bronze |
| Number of Positions 2 |
| Connector Type Header |
| Number of Positions Loaded All |
| Number of Rows 2 |
| Insulation Color Black |
| Contact Type Male Pin |
| Fastening Type Push-Pull |
| Material Flammability Rating UL94 V-0 |
| Shrouding Unshrouded |
| Contact Length - Mating 0.230" (5.84mm) |
| Contact Length - Post 0.090" (2.29mm) |
| Insulation Height 0.219" (5.56mm) |
| Contact Shape Square |
| Contact Finish - Mating Gold |
| Contact Finish - Post Tin |
| Insulation Material Polybutylene Terephthalate (PBT) |
| Contact Finish Thickness - Mating 30µin (0.76µm) |
| Row Spacing - Mating 0.100" (2.54mm) |
| Package_case - |
TSW-101-08-S-D-RA Garantías
• Responda con prontitud
• Calidad garantizada
• Acceso global
• Precio de mercado competitivo
• Servicios todo en uno de la cadena de suministro
Jinftry, es su proveedor de componentes más confiable, bienvenido a enviarnos la consulta, ¡gracias!
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Siéntete libre de contactarnos:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Correo electrónico primero )
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Comments
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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