Samtec Inc. TSW-127-06-G-D
- TSW-127-06-G-D
- Samtec Inc.
- CONN HEADER 54POS .100" DL GOLD
- Rectangular Connectors - Headers, Male Pins
- TSW-127-06-G-D Hoja de datos
- -
- -
- Lead free / RoHS Compliant
- 5293
- Inventario al contado / distribuidor autorizado / inventario restante de la fábrica
- Garantía de calidad de 1 año 》
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Part Number TSW-127-06-G-D |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description CONN HEADER 54POS .100" DL GOLD |
Package - |
Series TSW |
Operating Temperature -55°C ~ 125°C |
Mounting Type Through Hole |
Termination Solder |
Style Board to Board or Cable |
Contact Material Phosphor Bronze |
Number of Positions 54 |
Connector Type Header |
Number of Positions Loaded All |
Number of Rows 2 |
Insulation Color Black |
Contact Type Male Pin |
Fastening Type Push-Pull |
Material Flammability Rating UL94 V-0 |
Pitch - Mating 0.100" (2.54mm) |
Shrouding Unshrouded |
Contact Length - Mating 0.105" (2.67mm) |
Contact Length - Post 0.095" (2.41mm) |
Insulation Height 0.100" (2.54mm) |
Contact Shape Square |
Contact Finish - Mating Gold |
Contact Finish - Post Gold |
Insulation Material Polybutylene Terephthalate (PBT) |
Overall Contact Length 0.300" (7.62mm) |
Contact Finish Thickness - Mating 10µin (0.25µm) |
Row Spacing - Mating 0.100" (2.54mm) |
Package_case - |
TSW-127-06-G-D Garantías
• Responda con prontitud
• Calidad garantizada
• Acceso global
• Precio de mercado competitivo
• Servicios todo en uno de la cadena de suministro
Jinftry, es su proveedor de componentes más confiable, bienvenido a enviarnos la consulta, ¡gracias!
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Siéntete libre de contactarnos:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Correo electrónico primero )
Comments
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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